LONDON--(BUSINESS WIRE)--Process Systems Enterprise (PSE), a Siemens business, today released its rebranded gPROMS Process advanced process modelling environment. Formerly known as gPROMS ...

Unfortunately, this book can't be printed from the OpenBook. If you need to print pages from this book, we recommend downloading it as a PDF. Visit NAP.edu/10766 to get more information about this ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

Silicon photonics is an emerging and rapidly-expanding design platform that promises to enable higher-bandwidth communication and other applications. One of the best qualities of silicon photonics is ...

Siemens announced a new Additive Manufacturing (AM) Process Simulation solution for predicting distortion during 3D printing. The product is fully integrated into Siemens’ end-to-end Additive ...

The use of fiber-reinforced composites in Type 3, 4 and linerless Type 5 pressure vessels is growing, used to store compressed/renewable natural gas (CNG/RNG) and hydrogen as part of the global ...

Process chain for new SMC structural simulation approach demonstrated for Spirit AeroSystems reference wing rib redesigned to use carbon fiber SMC (C-SMC). Photo Credit, all images: Simutence, ...

Digital twins are increasingly being used as a tool to help inform wider business decisions as well as fundamentally changing business models. And, when implemented in an IIoT (Industrial Internet of ...

In 2023, as part of its HyMEET strategic project, Cetim acquired a new HySPIDE TP® machine and is still working on the material, manufacturing and design of high-pressure R&D storage tanks development ...