Abstract: Increasing demand for DRAM scaling and high-bandwidth has driven DRAM technology to 3D/2.5D integration. With the innovative Hybrid Bonding technology, a new Stacked Embedded DRAM (SEDRAM) ...
Abstract: We introduce a novel approach for the mask-constrained power synthesis of 1-D fields enabling near-field shaping according to arbitrary masks. This method presents an innovative framework ...
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